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  ? semiconductor components industries, llc, 2015 1 publication order number: march 2015- rev. 8 lc709203f/d lc709203f smart lib gauge battery fuel gauge lsi for 1-cell lithium-ion (li+) overview lc709203f is a fuel gauge for a single lithium ion battery. it is part of our smart lib gauge family of fuel gauges which measure the battery rsoc (relative state of charge) using its unique algorithm called hg-cvr . the hg-cvr algorithm eliminates the use of a sense resistor and provides accurate rsoc information even under unstable conditions (e.g. changes of battery; te mperature, loading, aging and self- discharge). an accurate rsoc contributes to the operating time of portable devices. lc709203f is available in two small packages realizing the industries smallest pcb footprint for the complete solution. it has minimal parameters to be set by the user enabling simple, quick setup and operation. features ? hg-cvr algorithm technology ? no external sense resistor ? 2.8% accuracy of rsoc ? accurate rsoc of aging battery ? automatic convergence of error ? adjustment for the parasitic impedance around the battery ? simple and quick setup ? low power consumption ? 3 a operational mode ? precision voltage measurement ? 7.5mv ? precision timer ? 3.5% ? alerts for low rsoc and / or low voltage ? temperature compensation ? sense thermistor input ? via i 2 c ? detect battery insertion ? i 2 c interface (up to 400 khz supported) applications ? wireless handsets ? smartphones / pda devices ? mp3 players ? digital cameras ? portable game players ? usb-related devices www.onsemi.com ordering information see detailed ordering and shipping information in the package dimensions section on page 23 of this data sheet wdfn8 3x4, 0.65p pb-free, halogen free type wlcsp9, 1.60x1.76 pb-free, halogen free type * i 2 c bus is a trademark of philips corporation.
lc709203f www.onsemi.com 2 application circuit example figure 1. example of an application schematic using lc709203f (temperature input via i 2 c.) figure 2. example of an application schematic using lc709203f (the temperature is measured directly by a thermistor.) system vdd i2c bus mas ter interrupt input system system vss pack- pa ck+ vs s test vss vdd alarm b lc709203f vdd t scl sda tsense tsw asic battery pack 1uf 10k 10k 10k system vdd i2c bus mas ter interrupt input system system vss vs s vdd alarm b pack- pa ck+ test vss tsw lc709203f vdd asic battery pack t scl sda tsense 1uf 10k (same ? as ? thermistor ? resistance ? value) 100 10k 10k 10k 10k thermi stor
lc709203f www.onsemi.com 3 figure 3. simplified block diagram figure 4. pin assignment test vss vdd alarmb 1 2 3 4 8 7 6 5 scl sda tsense tsw lc709203f wdfn8 3x4, 0.65p ?pb-free, halogen free type? top view wlcsp9, 1.60x1.76 ?pb-free, halogen free type? bottom view 3 2 1 sda test vss c b a tsense tsw vdd scl nc a larmb
lc709203f www.onsemi.com 4 table 1. pin function wdfn8 wlp9 pin name i/o description 1 1b test i connect this pin to v ss . 2 1a v ss - connect this pin to the battery?s negative ( ? ) pin. 3 3a v dd - connect this pin to the battery?s positive (+) pin. 4 2a alarmb o this pin indicates alarm by low output(open drain). pull-up must be done externally. alarm conditions are specified by registers (0x13 or 0x14). connect this pin to v ss when not in use. 5 3b tsw o power supply output for thermistor. this pin goes high during temperature read operation. resistance value of tsw (for thermistor pull-up) must be the same value as the thermistor. (note 1) 6 3c tsense i thermistor sense input. if you conne ct this pin to thermistor, insert 100 ? resistance between them for esd. (note 1) 7 1c sda i/o i 2 c data pin (open drain). pull-up must be done externally. 8 2c scl i/o i 2 c clock pin (open drain). pull-up must be done externally. - 2b nc - connect this pin to v ss . note 1: tsw and tsense must be disc onnected as figure 1 when not in use.
lc709203f www.onsemi.com 5 table 2. absolute maximum ratings at ta = 25 ? c, v ss = 0v parameter symbol pin/remarks conditions specification unit v dd [ v ] min typ max maximum supply voltage v dd max v dd ? 0.3 +6.5 v input voltage v i (1) tsense ? 0.3 v dd +0.3 output voltage v o (1) tsw ? 0.3 v dd +0.3 v o (2) alarmb ? 0.3 input/output voltage v io (1) sda, scl ? 0.3 +5.5 allowable power dissipation pd max wdfn8 ta = ? 40 to +85 ? c 480 mw wlp9 210 operating ambient temperature topr ? 40 +85 ? c storage ambient temperature tstg ? 55 +125 table 3. allowable operating conditions at ta = ? 40 to +85 ? c, v ss = 0v parameter symbol pin/remarks conditions specification unit v dd [ v ] min typ max operating supply voltage v dd (1) v dd 2.5 4.5 v high level input voltage v ih (1) tsense 2.5 to 4.5 0.7v dd v dd v ih (2) alarmb, sda, scl 2.5 to 4.5 1.4 low level input voltage v il (1) tsense 2.5 to 4.5 v ss 0.25v dd v il (2) alarmb, sda, scl 2.5 to 4.5 0.5 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should n ot be assumed, damage may occur and reliability may be affected. functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recomme nded operating ranges limits may affect device r eliab ility.
lc709203f www.onsemi.com 6 table 4. electrical characteristics at ta = ? 40 to +85 ? c, v ss = 0v parameter symbol pin/remarks conditions specification unit v dd [v] min typ max high level input current i ih (1) sda, scl v in = v dd (including output transistor off leakage current) 2.5 to 4.5 1 ? a low level input current i il (1) sda, scl v in = v ss (including output transistor off leakage current) 2.5 to 4.5 ? 1 high level output voltage v oh (1) tsw i oh = ? 0.4 ma 3.0 to 4.5 v dd ? 0.4 v v oh (2) i oh = ? 0.2 ma 2.5 to 4.5 v dd ? 0.4 low level output voltage v ol (1) tsw, alarmb, sda, scl i ol = 3.0 ma 3.0 to 4.5 0.4 v ol (2) i ol = 1.3 ma 2.5 to 4.5 0.4 hysteresis voltage vhys(1) sda, scl 2.5 to 4.5 0.1v dd pin capacitance cp all pins pins other than the pin under test vin = v ss ta = 25 ? c 2.5 to 4.5 10 pf reset release voltage(note 2) v rr v dd 2.4 v initialization time after reset release(note 2) t init 2.4 to 4.5 90 ms time measurement accuracy t me ta = ? 20 ? c to +70 ? c 2.5 to 4.5 ? 3.5 +3.5 % consumption current (note 3) i dd (1) v dd operational mode 2.5 to 4.5 3 4.5 ? a i dd (2) sleep mode 2.5 to 4.5 1 2 voltage measurement accuracy v me (1) v dd ta = +25 ? c 3.6 ? 7.5 +7.5 mv/cell v me (2) ta = ? 20 ? c to +70 ? c 2.5 to 4.5 ? 20 +20 note 2: once v dd voltage exceeds over the v rr , this lsi will release reset status. and the lsi goes into sleep mode t init after it. note 3: consumption current is a value in the range of ? 20 ? c to +70 ? c. product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product per formance may not be indicated by the electrical characteristics if operated under different conditions.
lc709203f www.onsemi.com 7 table 5. i 2 c slave characteristics at ta = ? 40 to +85 ? c, v ss = 0v parameter symbol pin/remarks conditions specification unit v dd [v] min max clock frequency tscl scl 2.5 to 4.5 400 khz bus free time between stop condition and start condition tbuf scl, sda see fig. 5. 1.3 ? s hold time (repeated) start condition first clock pulse is generated after this interval thd:sta scl, sda see fig. 5. 0.6 ? s repeated start condition setup time tsu:sta scl, sda see fig. 5. 0.6 ? s stop condition setup time tsu:sto scl, sda see fig. 5. 0.6 ? s data hold time thd:dat scl, sda see fig. 5. 0 0.9 ? s data setup time tsu:dat scl, sda see fig. 5. 100 ns clock low period tlow scl see fig. 5. 1.3 ? s clock high period thigh scl see fig. 5. 0.6 ? s clock/data fall time tf scl, sda 20 + 0.1c b 300 ns clock/data rise time tr scl, sda 20 + 0.1c b 300 ns wake up time from sleep mode twu sda see fig. 6. 400 ? s sda low pulse width to wake up tsp sda see fig. 6. 0.6 ? s wake up retention time from the falling edge of sda twr1 sda see fig. 6. 500 ms wake up retention time from stop condition twr2 scl, sda see fig. 6. 500 ms scl sda figure 5. i 2 c timing diagram t hd:st a t su:sto t buf t low t hd:da t t hig h t r t f t su:da t t su:sta t hd:sta ps s p
lc709203f www.onsemi.com 8 i 2 c communication protocol communication protocol type : i 2 c frequency : supported up to 400khz ic address [slave address] : 0x16 (it becomes "0001011x" when you write a binary, because the slave address is 7 bits. [x]=rd/wr.) bus protocols s : start condition sr : repeated start condition rd : read (bit value of 1) wr : write (bit value of 0) a : ack (bit value of 0) n : nack (bit value of 1) p : stop condition crc-8 : slave address to last data (crc-8-atm : ex.3778mv : 0x16, 0x09, 0x17, 0xc2, 0x0e ? 0x86) : master-to-slave : slave-to-master ? : continuation of protocol read word protocol s slave address wr a command code a ? sr slave address rd a data byte low a data byte high ? a crc-8 n p * when you do not read crc-8, there is not the reliability of data. crc-8-atm ex : (5 bytes) 0x16, 0x09, 0x17, 0xc2, 0x0e ? 0x86 write word protocol s slave address wr a command code a ? data byte low a data byte high a crc-8 a p * when you do not add crc-8, the written data (data byte low/high) become invalid. crc-8-atm ex : (4 bytes) 0x16, 0x09, 0x55, 0xaa ? 0x3b
lc709203f www.onsemi.com 9 wake up from sleep mode (not to scale) (not to scale) figure 6. i 2 c wake up timing diagram to wake up from sleep mode, and to start i 2 c communication, host side must set sda low prior to the i 2 c communication. the fuel gauge lsi enables i 2 c communication after the twu time period whic h is measured from the falling edge of sda, as above timing chart. this ?wake up cond ition? is invalid for the following two cases. 1) after twr1 timing following the falling edge of sda, the fuel gauge lsi ?wake up condition? goes into autonomous disable. once i 2 c communication is started, the operation doesn?t go into disable until the twr2 timing has elapsed after stop condition (below case). 2) after twr2 timing following i 2 c bus stop condition, the fuel gauge lsi ?wake up condition? goes into autonomous disable. if the ?wake up condition? goes into disable, set sda low to once again wake up from the sleep mode prior to the i 2 c communication. if operational mode is set, it is possible to start i 2 c communication without this ?wake up operation?. notice for i 2 c communication shared with another device when the i 2 c bus (on which the fuel gauge lsi is connected) is shared with another de vice the fuel gauge lsi must be in its operation mode before the other device starts i 2 c communication. enable i 2 c communication scl twr2 sda stop condition disable i 2 c communication sleep mode tsp enable i 2 c communication sda twu twr1 disable i 2 c communication disable i 2 c communication sleep mode
lc709203f www.onsemi.com 10 table 6. functi on of registers command code register name r/w range unit description initial value 0x04 before rsoc w 0xaa55: initialize rsoc executes rsoc initialization with sampled maximum voltage when 0xaa55 is set. - 0x06 thermistor b r/w 0x0000 to 0xffff 1k ? sets b-constant of the thermistor to be measured. 0x0d34 0x07 initial rsoc w 0xaa55: initialize rsoc executes rsoc initialization when 0xaa55 is set. - 0x08 cell temperature r 0x0000 to 0xffff 0.1k (0.0 = 0x0aac) displays cell temperature. 0x0ba6 (25 ) w 0x09e4 to 0x0d04 (i 2 c mode) sets cell temperature in i 2 c mode. 0x09 cell voltage r 0x0000 to 0xffff 1mv displays cell voltage. - 0x0a current direction r/w 0x0000: auto mode 0x0001: charge mode 0xffff: discharge mode selects auto/charge/discharge mode. 0x0000 0x0b apa (adjustment pack application) r/w 0x0000 to 0x00ff 1m ? sets parasitic impedance. - 0x0c apt (adjustment pack thermistor) r/w 0x0000 to 0xffff sets a value to adjust temperature measurement delay timing. 0x001e 0x0d rsoc r 0x0000 to 0x0064 1% displays rsoc value based on a 0-100 scale - 0x0f ite (indicator to empty) r 0x0000 to 0x03e8 0.1% displays rsoc value based on a 0-1000 scale - 0x11 ic version r 0x0000 to 0xffff displays an id number of an ic. - 0x12 change of the parameter r/w 0x0000 or 0x0001 selects a battery profile. 0x0000 0x13 alarm low rsoc r/w 0x0000: disable 0x0001to0x0064: threshold 1% sets rsoc threshold to generate alarm signal. 0x0008 0x14 alarm low cell voltage r/w 0x0000: disable 0x0001to0xffff: threshold 1mv sets voltage threshold to generate alarm signal. 0x0000 0x15 ic power mode r/w 0x0001: operational mode 0x0002: sleep mode selects power mode. (note4) 0x16 status bit r/w 0x0000: i 2 c mode 0x0001: thermistor mode selects temperature obtaining method. 0x0000 0x1a number of the parameter r 0x0301 or 0x0504 displays battery profile code. - 0xxxxx=hexadecimal notation note 4: see table 7. table 7. initial power mode device package initial power mode (0x15) lc709203fqh-0xtwg wdfn8 3x4, 0.65p 0x0001: operational mode lc709203fxe-0xmh wlcsp9, 1.60x1.76 0x0002: sleep mode
lc709203f www.onsemi.com 11 before rsoc (0x04) this lsi obtains open circu it voltage (ocv) reading 10 ms after power-on reset to initialize rsoc (see figure 7). or the lsi can be forced to initialize rsoc by sending the before rsoc command (0 ? 04 = aa55) or the initial rsoc command (0 ? 07 = aa55). the accuracy of the initialization requires the ocv reading to be taken with minimal load or charge, under 0.025c, on the battery. (i.e. less than 75ma for 3000mah design capac ity battery.). the lsi initializes rsoc by the maximum voltage between initialize after power-on reset and setting the command when the before rsoc command is written. (see figure 8). thermistor b (0x06) sets b-constant of the thermistor to be measured. refer to the specification sheet of the thermistor for the set value to use. initial rsoc (0x07) the lsi can be forced to initialize rsoc by sending the before rsoc command (0 ? 04 = aa55) or the initial rsoc command (0 ? 07 = aa55). figure 7. rsoc automatic initialization figure 8. before rsoc command the lsi initializes rsoc by the measured voltage at that time when the initial rsoc command is written. (see figure 9). the maximum time to initialize rsoc after the command is written is 1.5 ms. cell temperature (0x08) this register contains the cell temperature from ? 20 ? c (0 ? 09e4) to +60 ? c (0 ? 0d04) measured in 0.1 ? c units. in the thermistor mode (0 ? 16 = 01) the lsi measures the attached thermistor and loads the temperature into the cell temperature register. in the thermistor mode, the thermistor shall be connected to the lsi as shown in figure 2. the temperature is measured by ha ving tsw pin to provide power into the thermistor and tsense pin to sense the output voltage from the thermistor. temperature measurement timing is controlled by the lsi, and the power to the thermistor is not supplied for other reasons except to measure the temperature. in the i 2 c mode (0 ? 16 = 00) the temperature is provided by the host processor. during discharge/charge the register should be updates when the temperature changes more than 1 ? c cell voltage (0x09) this register contains the voltage on v dd 1mv units. current direction (0x0a) this register is used to control the reporting of rsoc. in auto mode the rsoc is reported as it increases or decreases. in charge mode the rsoc is not permitted to decrease. in discharge mode the rsoc is not permitted to increase. with consideration of capacity influence by temperature, we recommend operating in auto because rsoc is affected by the cell temperature. a warm cell has more capacity than a cold cell. be sure not to charge in the discharge mode and discharge in the charge mode; it will create an error. an example of rsoc reporting is shown in figures 10 and 11. figure 9. initial rsoc command
lc709203f www.onsemi.com 12 figure 10. discharge mode (an example with increasing in temperature. a warm cell has more capacity than a cold cell. therefore rsoc increases without charging in auto mode.) adjustment pack application (0x0b) this register contains the ad justment value to remove the influence of a parasitic resistance in user?s application on rsoc precision. the lsi measures rsoc by us ing battery impedance and the voltage. therefore, the parasitic resistance which exists in vdd/vss lines between measured battery or batte ry pack to the lsi can become an error factor. but the resistance of lines which is not connected other than the lsi is not included (please see figure 12.). the measured values of resistances are counted up to decide the value to be set. table 8 shows the example of the value to set this register. the factors of the value are the total resistance and the design capacity of the battery. the lower resistance may improve the rsoc precision. please see lc709203f application note fo r information about layout method of vdd/vss lines to reduce it. please contact on semiconductor if you don?t satisfy the rsoc precision. the deeper adjustment of apa may improve it. adjustment pack thermistor (0x0c) this is used to compensate fo r the delay of the thermistor measurement caused by a capacitor across the thermistor. the default value has been found to meet most of circuits where a capacitor like showing in figure13 is not put. please contact on semiconductor if you have an unusual circuit implementation. rsoc (0x0d) rsoc is reported in 1% units over the range 0% to 100%. indicator to empty (0x0f) this is the same as rsoc with a resolution of 0.1% over the range 0.0% to 100.0%. figure 11. charge mode (an example with decreasing in temperature. a cold cell has less capacity than a warm cell. therefore rsoc decreases without discharging in auto mode.) ic version (0x11) this is an id number of an lsi. change of the parameter (0x12) the lsi contains a data file co mprised of two battery profiles. this register is used to select the battery profile to be used. see table 9. register number of the parameter (0x1a) contains identity of the data file. the data file is loaded during fi nal test depending on the part number ordered. most of the time, battery nominal/rated voltage or charging voltage values are used to determine which profile data shall be used. please contact on semi if you cannot identify which profile to select. alarm low rsoc (0x13) the alarmb pin will be set lo w when the rsoc value falls below this value, will be released from low when rsoc value rises than this value. set to zero to disable. figure 14. alarm low cell voltage (0x14) the alarmb pin will be set low if vdd falls below this value, will be released from low if vdd rises than this value. set to zero to disable. figure 15.
lc709203f www.onsemi.com 13 figure 12. an example of parasitic resistance figure 13. an example of a capacitor across the thermistor table 8. apa table design capacity of battery total parasitic resistance apa(0x0b) 2000mah 0m ? 0x2d 10m ? 0x32 20m ? 0x37 3000mah 0m ? 0x2d 10m ? 0x35 20m ? 0x3c
lc709203f www.onsemi.com 14 figure 14. alarm low rsoc ic power mode (0x15) the lsi has two power modes. sleep (0x15 = 02) or operational mode (0x15 = 01). in the sleep mode only i 2 c communication functions. in the operational mode all functions operate with full calculation and tracking of rsoc during charge and discharge. if the battery is significantly charged or discharged during sleep mode, the rsoc will not be accurate. move d charge is counted continuously to measure the rs oc in operational mode. if battery is discharged or charge d in the sleep mode, the count breaks off. when it is switched from slee p mode to oper ational mode, rsoc calculation is continued by using the data which was measured in the previ ous operational mode. figure 15. alarm low cell voltage status bit (0x16) this selects the thermistor mode. thermistor mode (0x16 = 01) the lsi measures the attached thermistor and loads the temperature into the cell temperature register. i 2 c mode (0x16 = 00) the temperature is provided by the host processor. number of the parameter (0x1a) the lsi contains a data file co mprised of two battery profiles. this register contains identity of the data file. please see register change of the parameter (0x12) to select the battery profile to be used. see table 9. the data file is loaded during final test depending on the part number ordered. this file can be loaded in the field if required. please contact on semi if you cannot identify which profile to select. table 9. battery profile vs register ic type battery type nominal/rated voltage charging voltage number of the parameter(0x1a) change of the parameter(0x12) lc709203fxx-01xx 03 3.8 v 4.35v 0x0301 0x0000 01 3.7v 4.2v 0x0001 lc709203fxx-04xx 05 icr18650-26h (samsung) 0x0504 0x0000 04 ur18650zy (panasonic) 0x0001
lc709203f www.onsemi.com 15 hg-cvr tm hybrid gauging by current-voltage tracking with internal resistance hg-cvr tm is on semiconductor?s unique method which is used to calculate accurate rsoc. hg-cvr tm first measures battery voltage and temperature. precise reference voltage is essential for accurate voltage measurement. lc709203f has accurate internal reference voltage circuit with little temperature dependency. it also uses the measured batte ry voltage and internal impedance and open circuit voltage (ocv) of a battery for the current measurement. ocv is battery voltage without load current. the measured battery voltage is se parated into ocv and varied voltage by load current. the varied voltage is the product of load current and internal impedance. then the current is determined by the following formulas. where v(varied) i s varied voltage by load current, v(measured) is measured voltage, r(internal) is internal impedance of a battery. detailed information about the internal impedance and ocv is installed in the lsi. the internal impedance is affected by rema ining capacity, load-current, temperature, and more. then the lsi has the information as look up table. hg-cvr tm accumulates battery coulomb using the information of the current and a steady period by a high accuracy internal timer. the remaining capacity of a battery is calculated with the accumulated coulomb. how to identify aging by repeating discharge/charge, in ternal impedance of a battery will gradually increase, and the full charge capacity (fcc) will decrease. in coulomb countin g method rsoc is generally calculated using the fcc and th e remaining capacity (rm). then the decreased fcc must be preliminarily measured with learning cycle. but hg-cvr tm can measure the rsoc of deteriorated battery without learning cycle. the internal battery impedance that hg-cvr tm uses to calculate the current correlates highly with fcc. the correlation is based on battery chemistry. the rsoc that this lsi reports using the correlation is not affected by aging. figure 21-23 show rsoc measuremen t result of a battery with decreased fcc due to its aging. the shown rsoc is based on the decreased fcc even with a battery with 80% fcc after executing 300 times of discharge/charge. automatic convergence of the error a problem of coulomb counting method is the fact that the error is accumulated over time - this error must be corrected. the general gauges using coulomb counting method must find an opportunity to correct it. this lsi with hg-cvr tm has the feature that the error of rsoc converges, doesn?t emit without such an opportunity. the error constantly converges in the value estimated from the open circuit voltage. figure 24 shows the convergent characteristic from the initialize error. also, coulomb counting met hod cannot detect accurate residual change because the amount of the current from self-discharge is too small but hg-cvr tm is capable to deal with such detection by using the voltage information. simple and quick setup in general, it is necessary to obtain multiple parameters for a fuel gauge and it takes a lot of resource and additional development time of the users. one of the unique features of lc709203f is very small number of parameters to be prepared by the beginning of battery measurement ? the minimum amount of parameter which users may make is one because adjustment pack application register has to have one. such simple and quick start-up is realized by having multiple profile data in the lsi to suppor t various types of batteries. please contact your local sales o ffice to learn more information on how to measure a battery that cannot use already-prepared profile data. low power consumption low power consumption of 3 ? a is realized in the operation mode. this lsi monitors charge/d ischarge condition of a battery and changes the sampling rate accordi ng to its change of current. power consumption reduction w ithout deteriorating its rsoc accuracy was enabled by utilizing this method. power-on reset / battery insertion detection when this lsi detects battery insertion, it starts power-on reset automatically. once the battery voltage exceeds over the v rr , it will release reset status and will complete lsi initialization within t init to enter into sleep mode or operational mode (see table 7). all registers are initialized after power-on reset. please see figure 16. this lsi will also execute system reset automatically if a battery voltage exceeds under the v rr during operation. measurement starting flow after reset release, users can start battery measurement by writing appropriate value into the registers by following the flow shown in figure 17-18. please refe r to register function section for more information about each register. v(varied) = v(measured) ? ocv (1) i = (2) v(varied) r(internal) rsoc = ? 100% (3) rm fcc
lc709203f www.onsemi.com 16 set 0xaa55 to register 0x04 or 0x07 (note 6) input sda pulse set 0x0001 (note 5) to register 0x16 set 0x0001 to register 0x15 set 0xzzzz (note 5) to register 0x06 set 0xzzzz to register 0x0b note 5 : it's unnecessary if initial power mode is set 0x000z operational mode. to register 0x12 sda pulse can be substituded in som e kind of commands. ex: input "set operational mode" twice. note 6 : it's unnecessary if ocv can be get at automatic initialization. wake up from sleep mode set operational mode set apa set battery profile initial rsoc set thermistor mode set b-constant of thermistor power on initialization end timing diagram at power on figure 16. power on timing diagram (not to scale) starting flow figure 17. starting flow at thermistor mode v dd v rr reset initialization sleep mode tinit
lc709203f www.onsemi.com 17 set 0xaa55 to register 0x04 or 0x07 (note 6) input sda pulse set 0x0000 (note 5) to register 0x16 set 0x0001 to register 0x15 set 0xzzzz (note 5) to register 0x08 set 0xzzzz to register 0x0b note 5 : it's unnecessary if initial power mode is set 0x000z operational mode. to register 0x12 sda pulse can be substituded in som e kind of commands. ex: input "set operational mode" twice. note 6 : it's unnecessary if ocv can be get at automatic initialization. wake up from sleep mode set operational mode set apa set battery profile initial rsoc set via i2c mode set temperature power on initialization end figure 18. starting flow at i 2 c mode
lc709203f www.onsemi.com 18 typical characteristics figure 19. discharge characteristics by temperature change figure 20. discharge characteristics by load change
lc709203f www.onsemi.com 19 typical characteristics figure 21. discharge/charge cycle figure 22. battery capacity deterioration figure 23. 1 discharge characteristics of deterioration battery
lc709203f www.onsemi.com 20 typical characteristics figure 24. convergent characteristic from the initialize error
lc709203f www.onsemi.com 21 package dimensions unit : mm case 509af issue c a = assembly location y = year ww = work week = pb-free package *this information is generic. please refer to device data sheet for actual part marking. may or may not be present. generic marking diagram* xxxxx xxxxx ayww (note: microdot may be in either location) notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30mm from the terminal tip. 4. profile tolerance applies to the exposed pad as well as the leads. a b e d d2 e2 bottom view b e 8x 0.10 b 0.05 a c c note 3 2x 0.10 c pin one reference top view 2x 0.10 c a a1 (a3) 0.08 c 0.10 c c seating plane side view l 8x 14 5 8 dim min max millimeters a a1 0.00 0.05 b 0.20 0.30 d 3.00 bsc d2 1.70 1.90 e 4.00 bsc e2 2.30 2.50 e 0.65 bsc l 0.45 0.55 8x 0.70 1.96 0.35 1 0.65 pitch 2.56 *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended 8x dimensions: millimeters l1 detail a l alternate constructions l detail b detail a l1 note 4 e/2 soldering footprint* detail b mold cmpd exposed cu alternate constructions a3 0.20 ref 0.10 b a c 0.10 b a c 4.30 wdfn8 3x4, 0.65p
lc709203f www.onsemi.com 22 package dimensions unit : mm wlcsp9, 1.60x1.76 case 567jh issue b seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to the spherical crowns of the solder balls. 2x dim a min max ??? millimeters a1 d 1.60 bsc e b 0.20 0.30 e 0.50 bsc 0.51 e d a b pin a1 reference a 0.05 b c 0.03 c 0.08 c 9x b 123 c b a 0.10 c a a1 c 0.09 0.19 1.76 bsc 0.50 0.25 9x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.05 c 2x top view side view bottom view note 3 e recommended a1 package outline e pitch 0.50 pitch backcoat
lc709203f www.onsemi.com 23 on semiconductor and the on logo are registered trademarks of semiconductor components industries, llc (scillc) or its subsidiaries in the united st ates and/or other countries. scillc owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a lis ting of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf . scillc reserves the right to make changes with out further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any parti cular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specific ations can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated fo r each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc pro ducts are not designed, intended, or authorized for use as com ponents in systems int ended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees ar ising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that sci llc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject t oall applicable copyright laws and is not for resale in any manner. ordering information device package shipping (qty / packing) lc709203fqh-01twg wdfn8 3x4, 0.65p (pb-free / halogen free) 2000 / tape & reel lc709203fqh-02twg wdfn8 3x4, 0.65p (pb-free / halogen free) 2000 / tape & reel LC709203FQH-03TWG wdfn8 3x4, 0.65p (pb-free / halogen free) 2000 / tape & reel lc709203fqh-04twg wdfn8 3x4, 0.65p (pb-free / halogen free) 2000 / tape & reel lc709203fxe-01mh wlcsp9, 1.60x1.76 (pb-free / halogen free) 5000 / tape & reel lc709203fxe-02mh wlcsp9, 1.60x1.76 (pb-free / halogen free) 5000 / tape & reel lc709203fxe-03mh wlcsp9, 1.60x1.76 (pb-free / halogen free) 5000 / tape & reel lc709203fxe-04mh wlcsp9, 1.60x1.76 (pb-free / halogen free) 5000 / tape & reel ? for information on tape and reel specifications, including part orientation and tape sizes, plea se refer to our tape and reel packaging specifications brochure, brd8011/d. h ttp://www.onsemi.com/pub_lin k/collateral/brd8011-d.pdf (note) ic performance may vary depend on the types of battery to be in use. contact your local sales office for assistance in choosing the correct model.


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